Display device

ABSTRACT

To address static electricity on a flat panel display device and to implement a narrow frame of the flat panel display device. A liquid crystal display device (20) includes a counter substrate (22), a TFT substrate (21), and an upper polarizer (23). The TFT substrate (21) includes a terminal portion (30) projecting more outward than the edge of a counter substrate (22), and a ground pad (32) disposed on a surface of the terminal portion (30), the surface being on the side closer to the counter substrate (22). The upper polarizer (23) includes a pad facing portion (33) that overlaps the ground pad (32) at a position more outward than the edge of the counter substrate (22). The liquid crystal display device (20) further includes an electrically conductive member (34) filled in the gap between the ground pad (32) and the pad facing portion (33).

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese applicationJP2018-72880 filed on Apr. 5, 2018, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to display devices.

2. Description of the Related Art

Flat panel displays, such as liquid crystal display devices or organicelectroluminescence (EL) display devices, have a display panel includinglaminated substrates, for example, having a thin film transistor (TFT)thereon. In some cases, the operation of the display device may beaffected by static electricity charged on the display panel.

For example, a liquid crystal display device has liquid crystal betweena substrate (hereinafter referred to as a TFT substrate) having a TFTthereon, for example, and another substrate (hereinafter referred to asa counter substrate) disposed on the side closer to the image displaysurface and having a color filter thereon, for example. Such a liquidcrystal display device controls the orientation of the liquid crystalwith an electric field to thereby form an image. A display device suchas a touch panel having a touch sensing function incorporated on thecounter substrate side may have charges accumulated in the countersubstrate. The accumulated charges may cause unintentional applicationof an electric field to the liquid crystal, which possibly leads todisplay unevenness.

To address the above, conventionally, an electrically conductive layeris formed on the outside surface of the counter substrate to preventelectrification. FIG. 7 is a vertical cross-sectional view of aconventional liquid crystal display panel 1. In FIG. 7, a countersubstrate 3 is disposed on the TFT substrate 2. An electricallyconductive layer 4 is formed on the upper surface of the countersubstrate 3. An upper polarizer 5 is disposed on the electricallyconductive layer 4. A lower polarizer 6 is disposed under the TFTsubstrate 2. Liquid crystal 7 is held between the TFT substrate 2 andthe counter substrate 3.

The liquid crystal display panel 1 has an active area AA, or an imagedisplay area, and a peripheral frame area PA, or an area outside theactive area AA. The substrates, the polarizers, or the like need to bedisposed over the entire active area AA. Basically, the substrates orthe like are designed so as to have a larger dimension as compared withthe dimension of the active area AA by including a margin inconsideration of their tolerance. A terminal portion 8 is provided inthe peripheral frame area of the TFT substrate 2. The terminal portion 8projects more than the counter substrate 3, and has a terminal formed onthe upper surface of the terminal portion 8 for connection to a flexiblesubstrate 9.

The counter substrate 3 has an extension portion 10 extending moreoutward than the upper polarizer 5 and being not opposed to the upperpolarizer 5. The electrically conductive layer 4 on the upper surface ofthe extension portion 10 is electrically connected to a ground pad 11via an electrically conducive paste 12, in which the ground pad 11 isdisposed on the upper surface of the terminal portion 8 of the TFTsubstrate 2, the terminal portion 8 being adjacent to the extensionportion 10. The ground pad is grounded, for example, via a flexiblesubstrate 9 whereby the electrically conductive layer 4 is alsogrounded.

SUMMARY OF THE INVENTION

Provision of the extension portion 10 to the counter substrate 3 so thatthe electrically conductive layer 4 is exposed at a position where theelectrically conductive layer 4 is connected to the ground pad on thesurface of the TFT substrate 2 leads to a problem of a large peripheralframe area PA.

The present invention aims to implement a narrower frame of a displaydevice.

A display device according to the present invention includes a firstsubstrate, a second substrate, and a polarizer, the second substrate andthe polarizer together sandwiching the first substrate, wherein thesecond substrate includes a terminal portion and a ground pad, theterminal portion projecting more outward than the edge of the firstsubstrate, the ground pad being disposed on the surface of the terminalportion, the surface being on the side closer to the first substrate.The polarizer includes a pad facing portion that overlaps the ground padat a position more outward than the edge of the first substrate. Thedisplay device further includes an electrically conductive member in thegap between the ground pad and the pad facing portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a liquid crystal display deviceaccording to a first embodiment of the present invention;

FIG. 2 is a schematic vertical cross-sectional view of a liquid crystaldisplay device along the line II-II in FIG. 1;

FIG. 3 is a schematic plan view of a liquid crystal display deviceaccording to a second embodiment of the present invention;

FIG. 4 is a schematic vertical cross-sectional view of a liquid crystaldisplay device along the line IV-IV in FIG. 3;

FIG. 5 is a schematic vertical cross-sectional view of a part of aliquid crystal display device according to a third embodiment of thepresent invention, the part being relevant to a connection structurebetween an electrically conductive layer formed on the upper surface ofthe counter substrate and a ground pad formed on the TFT substrate;

FIG. 6 is a schematic vertical cross-sectional view of a part of aliquid crystal display device according to a fourth embodiment of thepresent invention, the part being relevant to a connection structurebetween an electrically conductive layer formed on the upper surface ofthe counter substrate and a ground pad formed on the TFT substrate; and

FIG. 7 is a vertical cross-sectional view of a conventional liquidcrystal display device.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention (hereinafter referred to asembodiments) will now be described based on the drawings.

The disclosure is merely an example, and, needless to say, anymodifications easily conceivable by a person killed in the art whileretaining the gist of the present invention are included in the range ofthe present invention. For more clarification of the descriptions, thedrawings may illustrate widths, thicknesses, shapes and so forth of therespective members schematically as compared with actual aspects in somecases. These are merely examples, and not intended to limitinterpretation of the present invention. In the specification andrespective drawings, members similar to those described earlier inconnection with drawings referred to earlier are given the samereference numerals, and detailed description thereof may be omitted.

First Embodiment

FIG. 1 is a schematic plan view of a liquid crystal display device 20according to a first embodiment. FIG. 2 is a schematic verticalcross-sectional view of the liquid crystal display device 20 along theline II-II in FIG. 1. FIG. 1 and FIG. 2 illustrate, in particular, aschematic structure of a display panel of the liquid crystal displaydevice 20.

The display panel of the liquid crystal display device 20 includes a TFTsubstrate 21 (a second substrate), a counter substrate 22 (a firstsubstrate), and an upper polarizer 23. In FIG. 2, the upper surface ofthe liquid crystal display device 20 corresponds to the image displaysurface side. The counter substrate 22 is disposed over the TFTsubstrate 21 so as to be opposed to the TFT substrate 21. The upperpolarizer 23 is disposed over the counter substrate 22. That is, the TFTsubstrate 21 and the upper polarizer 23 are disposed so as to be opposedto each other with the counter substrate 22 in-between.

On the surface of the upper polarizer 23 on the side closer to thecounter substrate 22, an electrically conductive adhesive layer 24 isformed. That is, the upper polarizer 23 is attached onto the countersubstrate 22 with the electrically conductive adhesive layer 24.Further, a lower polarizer 25 can be attached on the lower side of theTFT substrate 21. A gap is formed by a spacer (not illustrated) betweenthe TFT substrate 21 and the counter substrate 22. The TFT substrate 21is attached to the counter substrate 22 with a seal member 26. A liquidcrystal layer 27 is encapsulated inside the seal member 26.

FIG. 2 is a schematic view, as described above, and does not illustrate,for example, a cover glass that can be disposed on the front surface, orthe upper surface, of the display panel and a backlight for emittinglight to enter the back surface of the TFT substrate 21.

For example, an TFT, an electrode, and a wire, not illustrated, areformed on the TFT substrate 21. For example, the liquid crystal displaypanel in this embodiment employs a transverse electric field drive modein which electrodes for driving the liquid crystal are disposed only onthe TFT substrate 21 so that a voltage is applied to the liquid crystalin the horizontal direction. An example of the transverse electric fielddrive mode includes In Plane Switching (IPS) mode. Meanwhile, thecounter substrate 22 is, for example, a substrate having a black matrix,a color filter, or the like. The TFT substrate 21 and the countersubstrate 22 can be made, for example, using a glass substrate or aflexible resin substrate.

The TFT substrate 21, the counter substrate 22, the upper polarizer 23,and the lower polarizer 25 each have a dimension and a shape that coverthe active area AA. In this embodiment, since the active area AA isrectangular, the TFT substrate 21, the counter substrate 22, the upperpolarizer 23, and the lower polarizer 25 are accordingly illustratedschematically rectangular.

The TFT substrate 21 has a terminal portion 30 formed along one edge ofits rectangular shape. The terminal portion 30 projects more outwardthan the edge of the counter substrate 22. That is, the terminal portion30 projects horizontally outward (rightward in FIG. 1 and FIG. 2) fromthe edge of the counter substrate 22. A connection terminal forconnection to an outside circuit is disposed on the upper surface of theterminal portion 30. In this embodiment, a group of connection terminals(not illustrated) are aligned along an edge of the terminal portion 30.Flexible printed circuit board (FPC) 31 is connected to the connectionterminals. It is possible to mount a device such as an integratedcircuit (IC) on the FPC 31 with the Chip On Film (COF) technique.

Further, the TFT substrate 21 has a ground pad 32 on the upper surfaceof the terminal portion 30. The ground pad 32 is set to the groundpotential (GND). For example, the ground pad 32 is connected to a powersource for supplying GND via the FPC 31 and a wire formed on the surfaceof the TFT substrate 21.

Note that in the area of the TFT substrate 21 between the active area AAand the connection terminals along the edge of the terminal portion 30,a wire or the like (not illustrated) is disposed. Thus, it is possibleto dispose the ground pad 32, for example, outside the area with thewire formed. Specifically, as to the direction (the vertical directionin FIG. 1) of one edge of the TFT substrate 21, along which edge theterminal portion 30 is formed, the ground pad 32 can be disposed at aposition more outward than the portion to which the FPC 31 is connected.Note that, although the ground pad 32 is positioned at a lower side thanthe FPC 31 in the example in FIG. 1, the ground pad 32 can be positionedat an upper side than the FPC 31. Alternatively, the ground pad 32 canbe disposed at a plurality of positions, such as on the both sides ofthe FPC 31.

Meanwhile, the upper polarizer 23 has a pad facing portion 33 as its endportion projecting more outward than the edge of the counter substrate22. The pad facing portion 33 is opposed to the ground pad 32, andoverlaps the ground pad 32 in a plan view. In the example in FIG. 1, ofthe end portions of the upper polarizer 23, one whole edge of an endportion of the upper polarizer 23 on the same side as the terminalportion 30 of the TFT substrate 21 projects to the outside. Theprojecting portion includes the pad facing portion 33. It is sufficientthat the ground pad 32 and the pad facing portion 33 partially overlapeach other in a plan view. Alternatively, the ground pad 32 may bepositioned diagonally below, rather than directly below, the pad facingportion 33. For example, the ground pad 32 does not always have anoverlap with the pad facing portion 33 in a plan view.

Still alternatively, instead of one whole edge of the upper polarizer 23projecting uniformly, only a part of one edge of the upper polarizer 23may project horizontally to thereby constitute the pad facing portion33, similar to a pad facing portion 33 b illustrated in FIG. 3 for asecond embodiment to be described later. For example, forming the padfacing portion 33 as such when the ground pad 32 and the connectionterminals for connection to the FPC 31 are disposed with their positionsin the horizontal direction in FIG. 1 aligned, in other words, disposedso as to be aligned vertically in FIG. 1 along one edge of the TFTsubstrate 21 enables provision of the pad facing portion 33 whilepreventing the upper polarizer 23 from projecting above the connectionterminals.

The electrically conductive adhesive layer 24 is an adhesive member foradhering the upper polarizer 23 to the counter substrate 22. Theelectrically conductive adhesive layer 24 has electric conductivity.Basically, the electrically conductive adhesive layer 24 is disposedover the entire surface of the active area AA and continues from theactive area AA to the pad facing portion 33. That is, on the surface ofthe pad facing portion 33, the surface facing the TFT substrate 21, theelectrically conductive adhesive layer 24 is present as an electricallyconductive layer continuing to the active area AA. The electricallyconductive adhesive layer 24, which overlaps the active area AA, is madeof transparent material. For example, material having a sheet resistanceof, for example, 1×10⁸ to 1×10¹¹Ω/□, can be used to form theelectrically conductive adhesive layer 24.

The counter substrate 22 is not present between the ground pad 32 andthe pad facing portion 33, and a gap is formed instead. In the gapbetween the ground pad 32 and the pad facing portion 33, an electricallyconductive paste is filled as the electrically conductive member 34.Injection and filling of the electrically conductive paste into the gapis achieved using a known technique, such as a dispenser method forejecting coating material from a dispenser nozzle or an inkjet methodfor ejecting coating material from an inkjet head. Electricallyconductive paste is, for example, an electrically conductive materialcontaining a resin and a filler, such as silver particles, dispersed inthe resin to form conductive paths for charges. Such electricallyconductive material is cured through heating or drying.

The electrically conductive member 34 is in contact with the ground pad32 and also with the electrically conductive adhesive layer 24 on thesurface of the pad facing portion 33. Hence, the electrically conductiveadhesive layer 24, which is disposed also in the active area AA, iselectrically connected to the ground pad 32, whereby the potential ofthe electrically conductive adhesive layer 24 is set to GND.

In a liquid crystal display panel of the IPS mode, the absence of anelectrically conductive layer, such as an electrode, on the countersubstrate 22 results in undesired accumulation of charges in the countersubstrate 22. This may likely cause display unevenness described above.Regarding this point, the liquid crystal display device 20 in thisembodiment has the electrically conductive adhesive layer 24 as anelectrically conductive layer disposed between the counter substrate 22and the upper polarizer 23 of the liquid crystal display panel, and theelectrically conductive adhesive layer 24 is connected to the ground pad32 via the electrically conductive member 34 whereby the potential ofthe electrically conductive adhesive layer 24 is set to GND, asdescribed above. This structure makes it less likely for staticelectricity to be accumulated in the counter substrate 22, thuspreventing occurrence of display unevenness.

In the above-described structure in FIG. 7, the electrically conductivelayer 4 on the upper surface of the counter substrate, which extendsoutward from the upper polarizer, is horizontally bridged to the groundpad 11 of the TFT substrate, which is positioned more horizontallyoutward than the electrically conductive layer 4, with the electricallyconductive paste 12. On the contrary, in the liquid crystal displaydevice 20 in this embodiment, as for the positional relationship in thehorizontal direction, the pad facing portion 33 of the upper polarizer23 overlaps the ground pad 32 of the TFT substrate 21, and theelectrically conductive layer on the back surface (the surface closer tothe TFT substrate) of the pad facing portion 33 is vertically bridged tothe ground pad 32 with the electrically conductive paste. This structureof the liquid crystal display device 20 in this embodiment, includingthe ground pad 32 disposed on one edge of the TFT substrate 21 on theside closer to the FPC 31 enables reduction in the dimension of theperipheral frame area along the one edge, thus contributing to a smallerframe.

Second Embodiment

FIG. 3 is a schematic plan view of a liquid crystal display device 20Baccording to a second embodiment. FIG. 4 is a schematic verticalcross-sectional view of the liquid crystal display device 20B along theline IV-IV in FIG. 3. FIG. 3 and FIG. 4 respectively correspond to FIG.1 and FIG. 2 for the first embodiment, in particular, illustrating aschematic structure of the display panel of the liquid crystal displaydevice 20B.

The display panel of the liquid crystal display device 20B differs fromthat of the liquid crystal display device 20 in the first embodiment inthat the TFT substrate 21 of the former display panel has a terminalportion 35 that is formed along the edge of its rectangular shape on theopposite side from the FPC 31 so as to project horizontally more thanthe counter substrate 22, and in that a ground pad 32 b in thisembodiment, corresponding to the ground pad 32 in the first embodiment,is disposed not on the terminal portion 30 (a second terminal portion)connected to the FPC 31, but on the terminal portion 35 (a firstterminal portion) on the opposite side.

A test pattern 36 is disposed as a terminal on the upper surface of theterminal portion 35. A test pattern 36 is an electrode pad where a probeis to stand in a test of display operation of the liquid crystal displaydevice 20. To enable tests with the probe, the terminal portion 35projects more outward than the counter substrate 22 and the upperpolarizer 23, for example.

The potential of the ground pad 32 b is set to GND. For example, theground pad 32 b is connected to a power source for supplying GND via theFPC 31 and a wire formed on the surface of the TFT substrate 21. Forexample, a wire 37 can be disposed in the peripheral frame areapositioned on a lower side (or on an upper side) than the active area AAin FIG. 3 to connect the ground pad 32 b and the FPC 31.

The ground pad 32 b can be disposed, for example, outside the area withthe test pattern 36 on the terminal portion 35. Specifically, as to thedirection (the vertical direction in FIG. 3) of one edge of the TFTsubstrate 21, along which the terminal portion 35 is formed, the groundpad 32 b can be disposed at a position more outward than a positionwhere the test pattern 36 is disposed. Although the ground pad 32 b ispositioned at a lower side than the test pattern 36 in the example inFIG. 3, the ground pad 32 b can be positioned at an upper side than thetest pattern 36 or at a plurality of positions, such as on both sides ofthe test pattern 36.

The upper polarizer 23 has a pad facing portion 33 b as its end portionprojecting more outward than the counter substrate 22. The pad facingportion 33 b overlaps the ground pad 32 b. In the example illustrated inFIG. 3, of four sides of the upper polarizer 23, only a part of one sidelocated on the same side as the terminal portion 35 of the TFT substrate21 projects horizontally more than the counter substrate 22 therebyforming the pad facing portion 33 b. As for the horizontal positionalrelationship in FIG. 3, for example, it is preferable that the dimensionof projection of the terminal portion 35 be smaller in order toimplement a smaller frame. For this purpose, the ground pad 32 b and thetest pattern 36 are disposed such that the respective positions of theground pad 32 b and the test pattern 36 in the horizontal directionoverlap each other. In other words, the ground pad 32 b and the testpattern 36 can be disposed aligned in the vertical direction along oneedge of the TFT substrate 21, as illustrated in FIG. 3. In such a caseas well, forming only the pad facing portion 33 b so as to projecthorizontally, as illustrated in FIG. 3, enables preventing the upperpolarizer 23 from projecting above the test pattern 36. As for thehorizontal position in FIG. 3, in the case that the ground pad 32 b canbe disposed with displacement toward the active area AA rather than thetest pattern 36, the upper polarizer 23 can be formed such that its onewhole edge projects uniformly, as illustrated in FIG. 1 for the firstembodiment, to thereby form the pad facing portion 33 b.

A structure for connecting the electrically conductive adhesive layer 24to the ground pad 32 b is formed using the pad facing portion 33 b,similar to the first embodiment. Specifically, the counter substrate 22is not present between the ground pad 32 b and the pad facing portion 33b, and a gap is formed instead. Further, the electrically conductiveadhesive layer 24 is present as an electrically conductive layer on thesurface of the pad facing portion 33 b, the surface on the side facingthe TFT substrate 21. Electrically conductive paste as an electricallyconductive member 34 b is filled in the gap between the ground pad 32 band the pad facing portion 33 b, whereby the electrically conductiveadhesive layer 24 is electrically connected to the ground pad 32 b withthe electrically conductive member 34 b.

This embodiment as well can produce an effect of countermeasures againststatic electricity and also an effect of reducing the dimension of aframe, as described in the first embodiment.

Third Embodiment

The respective liquid crystal display devices 20, 20B in the first andsecond embodiments each include the electrically conductive adhesivelayer 24 as an electrically conductive layer between the countersubstrate 22 and the upper polarizer 23. The display panel of a liquidcrystal display device 20C according to the third embodiment differsfrom the respective display panels of the liquid crystal display devices20, 20B in the first and second embodiments in that the former displaypanel includes a transparent electrically conductive film 40 between thecounter substrate 22 and the electrically conductive adhesive layer 24so that the electrically conductive layer between the counter substrate22 and the upper polarizer 23 includes not only the electricallyconductive adhesive layer 24 but also the transparent electricallyconductive film 40.

FIG. 5 is a schematic vertical cross-sectional view of a part of theliquid crystal display device 20C, the part being relevant to theconnection structure between an electrically conductive layer disposedon the upper surface of the counter substrate 22 and the ground pad 32 bdisposed on the TFT substrate 21. Although the connection structure forthe ground pad 32 b disposed on the side closer to the terminal portion35, similar to the second embodiment, is described here, a connectionstructure having a similar characteristic can be achieved also in thecase that the ground pad 32 is disposed on the side closer to theterminal portion 30, similar to the first embodiment.

The electrically conductive adhesive layer 24 is similar to those in thefirst and second embodiments, and present on the surface of the padfacing portion 33 b, the surface on the side facing the TFT substrate21.

The transparent electrically conductive film 40 is made of, for example,Indium Tin Oxides (ITO) and disposed on the surface of the countersubstrate 22, the surface being on the side closer to the upperpolarizer 23.

For example, the upper polarizer 23 having the electrically conductiveadhesive layer 24 thereon is disposed on the counter substrate 22 withthe transparent electrically conductive film 40 thereon such that theupper polarizer 23 is adhered with the electrically conductive adhesivelayer 24 onto the transparent electrically conductive film 40 on thecounter substrate 22. With the above, the electrically conductiveadhesive layer 24 and the transparent electrically conductive film 40overlap each other, thereby together constituting a single electricallyconducive layer. Grounding the electrically conductive layer between thecounter substrate 22 and the upper polarizer 23 enables preventingundesired accumulation of charges in the counter substrate 22.

As a structure for grounding the electrically conductive layer includingthe electrically conductive adhesive layer 24 and the transparentelectrically conductive film 40, the pad facing portion 33 b is providedto the upper polarizer 23, and electrically conductive paste is filledas the electrically conductive member 34 b in the gap between the groundpad 32 b and the pad facing portion 33 b. The electrically conductivemember 34 b is in contact with the electrically conductive adhesivelayer 24 under the pad facing portion 33 b, whereby the electricallyconductive layer including the electrically conductive adhesive layer 24and the transparent electrically conductive film 40 is electricallyconnected to the ground pad 32 b.

Basically, the transparent electrically conductive film 40 is formed onthe entire surface of the counter substrate 22 on the side closer to theupper polarizer 23, and the side surface of an end portion of thetransparent electrically conductive film 40 is exposed on the sidesurface of the liquid crystal panel as the side surface of an endportion of the counter substrate 22 is, the side surface facing the gapbetween the ground pad 32 b and the pad facing portion 33 b. Theelectrically conductive member 34 b is in contact with the transparentelectrically conductive film 40, which is exposed on the side surface.This structure as well enables electrical connection of the electricallyconductive layer including the electrically conductive adhesive layer 24and the transparent electrically conductive film 40 to the ground pad 32b.

In this embodiment, the electrically conductive adhesive layer 24 andthe transparent electrically conductive film 40 can be formed such thatthe combined seat resistance becomes, for example, 1×10⁸ to 1×10¹¹Ω/□.

This embodiment as well can achieve an effect of countermeasures againststatic electricity and also an effect of reducing the dimension of aframe, as described in the first and second embodiments.

Fourth Embodiment

The display panel of a liquid crystal display device 20D according to afourth embodiment differs from the respective display panels of theliquid crystal display devices in the first to third embodiments in thatthe electrically conductive layer between the counter substrate 22 andthe upper polarizer 23 of the former display panel does not include theelectrically conductive adhesive layer 24, but includes only thetransparent electrically conductive film 40 described in the thirdembodiment.

FIG. 6 is a schematic vertical cross-sectional view of a part of theliquid crystal display device 20D, the part being relevant to aconnection structure for the transparent electrically conductive film 40on the upper surface of the counter substrate 22 and the ground pad 32 bon the TFT substrate 21. Although such a connection structure for theground pad 32 b disposed on the side closer to the terminal portion 35,similar to the second embodiment, is described here, a connectionstructure having a similar characteristic can be achieved also in thecase that the ground pad 32 is disposed on the side closer to theterminal portion 30, similar to the first embodiment.

For example, the upper polarizer 23 is disposed on the counter substrate22 with the transparent electrically conductive film 40 thereon. In theabove, for example, the upper polarizer 23 can be adhered onto thetransparent electrically conductive film 40 on the counter substrate 22,for example, with non-electrically conductive adhesive agent (notillustrated).

As a structure for grounding the electrically conductive layer includingthe transparent electrically conductive film 40, the pad facing portion33 b is provided to the upper polarizer 23, and electrically conductivepaste as the electrically conductive member 34 b is filled in the gapbetween the ground pad 32 b and the pad facing portion 33 b. Asdescribed in the third embodiment, the side surface of an end portion ofthe transparent electrically conductive film 40 is exposed on the sidesurface of the liquid crystal panel as the side surface of an endportion of the counter substrate 22 is, the side surface facing the gapbetween the ground pad 32 b and the pad facing portion 33 b. Theelectrically conductive member 34 b is in contact with the transparentelectrically conductive film 40 exposed on this side surface, wherebythe transparent electrically conductive film 40 is electricallyconnected to the ground pad 32 b to be thereby grounded.

This embodiment as well can achieve an effect of countermeasures againststatic electricity and also an effect of reducing the dimension of aframe, as described in the first to third embodiments.

In the conventional structure illustrated in FIG. 7, since theelectrically conductive paste 12 is present outside the upper polarizer5, the electrically conductive paste 12 can be raised from the uppersurface of the upper polarizer 5. This can cause distortion in placing acover glass on the upper polarizer 5. On the contrary, according to thisembodiment, since the electrically conductive member 34, 34 b is presenteither on the back surface or a part of the side surface of the upperpolarizer 23, the upper surface of the upper polarizer 23 can remainflat even where the electrically conductive member 34, 34 b ispositioned. This structure can reduce a possible of causing distortionto a cover glass to be disposed on the upper polarizer 23.

Note that the present invention is not limited to the above-describedembodiments, and various modifications are possible. For example, thestructures described in the embodiments can be replaced with asubstantially identical structure, a structure producing the sameeffect, or a structure achieving the same object.

The present invention can be applied to other electro-optical devices,such as organic EL display devices, micro LEDs, or electrophoresisdevices, to attain countermeasures against statistic electricity and toimplement narrow frames.

While there have been described what are at present considered to becertain embodiments of the invention, it will be understood that variousmodifications may be made thereto, and it is intended that the appendedclaims cover all such modifications as fall within the true spirit andscope of the invention.

What is claimed is:
 1. A display device including a counter substrate, aTFT substrate, a polarizer, and an electrically conductive layer,wherein the counter substrate is disposed between the TFT substrate andthe polarizer, the electrically conductive layer is disposed between thecounter substrate and the polarizer, the TFT substrate includes aterminal portion and a ground pad, the terminal portion projecting moreoutward than an edge of the counter substrate, the ground pad beingdisposed on a surface of the terminal portion, the surface being on aside closer to the counter substrate, the polarizer includes a padfacing portion that overlaps the ground pad at a position more outwardthan the edge of the counter substrate, an edge of the Dad facingportion being located between the edge of the counter substrate and anedge of the TFT substrate, the electrically conductive layer includes apad facing portion that overlaps the pad facing portion of thepolarizer, the display device further comprises an electricallyconductive member, and the electrically conductive member connects theground pad and the pad facing portion of the electrically conductivelayer.
 2. The display device according to claim 1, wherein theelectrically conductive layer is an electrically conductive adhesivelayer for adhering the polarizer onto the counter substrate, and theelectrically conductive member is in contact with the electricallyconductive adhesive layer on a surface of the pad facing portion of thepolarizer.
 3. The display device according to claim 2, wherein theelectrically conductive layer further includes a transparentelectrically conductive film between the counter substrate and theelectrically conductive adhesive layer, and the electrically conductivemember is in contact with the transparent electrically conductive filmat a position adjacent to an end portion of the counter substrate. 4.The display device according to claim 2, wherein the TFT substrateincludes a connection terminal formed in the terminal portion, theconnection terminal being for electrical connection to an outsidedevice, and the ground pad and the connection terminal are positioned ona same side relative to an image display area.
 5. The display deviceaccording to claim 1, wherein the TFT substrate includes a secondterminal portion including a connection terminal for electricalconnection to an outside device, wherein provided that the terminalportion with the ground pad is a first terminal portion, the firstterminal portion and the second terminal portion are positioned onrespective opposite sides with an image display area in-between.